Predict equipment failures to eliminate costly wafer scrap or rework by no longer running to fail.
Make run to fail maintenance practices a thing of the past by implementing condition based monitoring of your equipment. Empower your maintenance personnel to proactively take action prior to a catastrophic equipment failure to avoid costly downtime and repairs.
Utilize failure analysis and classification to quickly diagnose the root cause of equipment and process issues to return your equipment back into production faster than ever before.
Optimize your maintenance schedules to reduce costs associated with unnecessary maintenance activities. Exchange parts and consumables based on their actual condition rather than relying on antiquated and costly preventive maintenance practices.
Improve equipment uptime using a combination of proactive maintenance strategies, such as predictive maintenance and equipment maintenance schedule optimization helps ensure that all maintenance activities are performed at the most opportune times to minimize downtime. Enhance your existing equipment with more advanced control technologies to eliminate periodic control system maintenance required by antiquated control systems.
Enhance equipment controller capabilities to achieve tighter process specifications without buying new equipment.
More precise control of critical control variables reduces stabilization phases of your process allowing you to push more wafers through your equipment.
Utilize equipment controller enhancements and run-to-run process control systems to improve manufacturing quality and increase device yield.
Our products are not do-it-yourself tool kits or projects. Immediately benefit from our extensive domain knowledge and experience in semiconductor manufacturing to solve any problem you might be facing.
SEMI Equipment Communications Standard (SECS) and Generic Equipment Model (GEM) are protocols utilized for equipment-to-host data communications in the semiconductor industry.
Representational State Transfer Application Programming Interface (REST API) is a widely used communication interface for web-based software applications. It allows different software applications to communicate with each other by exchanging data over a standard protocol, enabling fast and efficient software development and integration.
SEMI Standard Equipment Data Acquisition (EDA) Interface-A is a data acquisition protocol utilized in the semiconductor industry. It is a self-defining data subscription protocol providing one-way communication to any software application.
Resistance monitoring to prevent wafer scrap and equipment downtime. Model Based Temperature Control (MBTC) retrofits to improve process capability and eliminate real-time and offline profiling. Heating Element Life Optimization (HELO) controllers increase element lifetime.
Vibration monitoring of linear actuators and drives to predict mechanical failure, particle contamination, and wafer load/unload errors.
Vibration monitoring to detect mechanical wear and failure of motors, gearbox, lobes, screws, and casings to prevent wafer scrap, minimize rebuild costs, and validate incoming rebuild quality.
Vibration monitoring of polishing heads, platens, and pad conditioning arms to monitor mechanical wear and failure as well as detect wafer scratching and breakage. Real-time pad conditioner downforce monitoring to improve polishing repeatability.
Vibration monitoring of ferrofluid seal, motor and mechanical linkage to prevent particle contamination and wafer scrap
Voltage monitoring and redundancy protection for power supplies to reduce scrap and downtime as well as improve your mean time to repair.
Current or vibration monitoring of bearings and motors of the exhaust fans to prevent electronic component overheating and failure.
Detect water and chemical leaks underneath equipment before it becomes a safety hazard or damages your equipment.
Automated adjustment of process recipe parameters in atmospheric processes to compensate for barometric pressure disturbances improving process run-to-run repeatability.
Pressure monitoring of exhaust draw to detect clogging in the lines or abatement system to prevent wafer scrap and equipment downtime
Resistance and light intensity monitoring to process uniformity variation and wafer scrap.
Resistance monitoring to prevent wafer scrap and reduce equipment downtime
Resistance monitoring to prevent wafer scrap and reduce equipment downtime
Gas flow monitoring to ensure MFC integrity to reduce wafer scrap and process drift
Vibration based stroke monitoring of diaphragm and bellows pumps detects filter clogging and mechanical failure. Real-time pneumatic pressure measurement detects air leaks in pneumatic tubing, shuttle valves, manifolds, and compression fittings.
Vibration monitoring to prevent wafer scrap and process tool damage as well as reduce rebuild costs
Vibration monitoring to detect component degradation and calibration drift of the robot to prevent wafer scrap and equipment downtime
Vibration monitoring to detect misalignment of the automation resulting in wafer scratching or breakage
Vibration monitoring of compressors, chilled water pumps, and condenser water pumps to predict mechanical wear and failure of motors, gears, bearings, and impellers. In situ monitoring of water quality, temperature, pressure, flow, and leaks as well as refrigerant charge and leaks.
Vibration monitoring to predict mechanical wear and failure of motors, gears, bearings, and other surfaces. In situ monitoring of oil quality, temperature, and pressure.
Vibration monitoring to detect mechanical wear and failure of motors, gearbox, lobes, screws, and casings. In situ monitoring of oil quality, temperature, and pressure.
Vibration monitoring of water pumps (chilled, condenser, deionized, and reverse osmosis) as well as chemical pumps to predict mechanical wear and failure of motors, bearings, couplings, and impellers. In situ monitoring of media quality, temperature, pressure, flow, and leaks.
Vibration monitoring of water pumps and air handlers to predict mechanical wear and failure of motors, gears, bearings, couplings, and impellers. In situ monitoring of temperature, pressure, flow, and leaks.
Vibration monitoring of air handlers, chillers, cooling towers, and water pumps to detect mechanical wear and failure. HEPA filter differential pressure monitoring for condition based exchange. Resistance monitoring of electric heaters to predict failures. Localized air quality monitoring for particle source detection.
Detect water and chemical leaks along pipes before it becomes a safety hazard or damages your facility.
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